Photonic Process Engineer: Wire Bonding & Die Attach (Ottawa)
Photonic Process Engineer: Wire Bonding & Die Attach (Ottawa)
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Ottawa, Canada -
Last edited: less than a week ago
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Description
A leading technology firm in Ottawa is seeking a motivated Process Engineer to optimize assembly processes for Photonic Integrated Circuit products. The ideal candidate has a Bachelor’s degree in mechanical engineering and 2–3 years of relevant experience. Responsibilities include designing wire bonding recipes and conducting reliability testing. Market-competitive salary range of $71,600 to $114,400 and comprehensive benefits offered. #J-18808-Ljbffr Apply on Kit Job: kitjob.ca/job/2og2nf
Highlights
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Company nameCiena -
Job positionPhotonic Process Engineer: Wire Bonding & Die Attach (Ottawa)
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